Co Wang BEI micrographs of the Sn/Co interfacial reactions at 250 °C for various durations. (a) 30 min and (b) 1 h.
(a) Growth thickness of CoSn3 layer as a function of reaction time in the Sn/Co couples at 240?260 °C.
(b) Arrhenius plot of ln(k) versus 1000/T. BEI micrographs of the Sn/Co interfacial reactions annealed for 2 h at (a) 320 °C, (b) 340 °C and (c) 327 °C.
Li
→52In−48Sn SEM images of IMCs features and distributions: (a) Cu/In-Sn couple after
2 h; (b) Ni/In-Sn couple after 24 h; (c) Pt/In-Sn couple after
3 weeks;
(d) Ti/In-Sn couple after 96 h; (e) V/In-Sn couple after 12 days;
and (f) Nb/In-Sn couple after 3 months.