Japanese version is here.
What's New

　We can supply highly functionl lapping tools and epoxy polishing pads (porous type and nonwaven type) which can accomplish high removal rate. Please watch from left link.
 
News
☆2016/6/22(Wed)
　Prof. Tani made a presentation entitled "Diamond abrasives for electroplated diamond wires" which was held by MOBIO.
　In the presentation diamond abrasives with high acid resistance and high electric conductivity were introduced, which are applied in the production line of electroplated diamond wires. The adoption of the abrasives realizes low-cost production of wires with long-time stability. We started the sample offer.
 
Contact
1-1-1 Noji-higashi, Kusatsu-City, Shiga, 525-8577 JAPAN
Tool Bank East Co. Ltd.
Fabrication Laboratory
Department of Mechanical Engineering
College of Science and Engineering
Ritsumeikan University
TEL/FAX:+81-77-574-3128
e-mail:okiharu@hera.eonet.ne.jp

Please enquire to Prof. Tani about technical contents of this homepage.
TEL/FAX:+81-77-561-3043